Test Test Test Impressum Impressum Imprint
We utilize visual and electrical inspection methods to ensure consistently high delivery quality. Our techniques include: Socket-based testing for integrated circuits (ICs), including selection and verification of chip revisions Flying probe testing for populated assemblies Microscopic die inspection of semiconductors Selection of electronic components, including tolerance and quality assessment Employment of specialized testing systems for power semiconductors, capacitors, and relays IC programming, including frequency-specific programming (MEMS) IC replacement, as well as repair and rework of electronic assemblies
Inspection and Test
Die-marking and Die-Revision check
Semiconductor Tests
Assemblies Assemblies Components Components Contact Contact