We utilize visual and electrical inspection methods to ensure consistently
high delivery quality. Our techniques include:
Socket-based testing for integrated circuits (ICs), including selection and
verification of chip revisions
Flying probe testing for populated assemblies
Microscopic die inspection of semiconductors
Selection of electronic components, including tolerance and quality assessment
Employment of specialized testing systems for power semiconductors, capacitors, and relays
IC programming, including frequency-specific programming (MEMS)
IC replacement, as well as repair and rework of electronic assemblies
Inspection and Test
Die-marking and Die-Revision check
Semiconductor Tests
